1) The machine adopts imported strong and durable ROCHLING double-layer plate which can be used in acid corrosion environment for a long time and prevent leakage.

2) A kind of process equipment using HF+HNO3/H3P04+HNO3 and other processes to etch and clean the surface of silicon wafers, and can clean 4", 5" and 6" silicon wafers.

3) Both manual and automatic operations are available. The automatic operation mode adopts two independent mechanical arms to operate, which can be lifted up and down.

4) Cleaning Ability: 4 to 6 inch wafers, 25 pcs/2 baskets/batch

5) The temperature of each process tank can be controlled independently.

6) Modular design of tanks in each process, with the corrosion tank and pure water flushing tank placed in a uniform leak-bearing chassis. The corrosion tank is designed to exhaust air through the bottom and reduces the amount of exhaust air.

7) The process tank is designed to be lifted and lowered, making cleaning faster and more thorough.

8) The control part adopts imported brands PLC and HMI;

9) A PTFE pure water gun and a PTFE nitrogen gun are set on the right front side of the machine.

10) Equipment design standards are implemented according to semiconductor industry standards (SEMI-S2-93) and standardized and guaranteed according to ISO9001 quality management system.